High-Density CDU and Liquid Cooling Solution

Liebert XDU
Cooling Distribution Unit

Optimized for artificial intelligence (AI) and GPU-intensive workloads, Liebert XDU provides continuous liquid distribution for direct-to-chip cooling and rear-door heat exchangers.

Future-Ready Hybrid Cooling

Liebert XDU Cooling Distribution Unit

Future-ready liquid cooling infrastructure for Artificial Intelligence (AI) and High-Performance Computing (HPC) workloads.

Designed to provide high-density cooling in data centers, Liebert XDU offers cost-effective, easy-to-deploy solutions for direct-to-chip and rear-door heat exchanger (RDHx) applications.

High Heat Transfer Capacity

With a nominal capacity of 1368 kW, it supports chip-level cooling for demanding AI and GPU workloads, enabling higher rack densities.

Flexible Integration

Supports rapid integration into different data center environments, with or without access to facility cooling water.

AI and HPC Ready

Its 1368 kW nominal capacity supports demanding GPU workloads and direct-to-chip cooling requirements in high-density racks.

Fully Redundant Protection

An N+1 redundant pump system, integrated 50-micron filtration and leak detection support continuous operation for critical workloads.

Ideal Applications

Designed for AI and High-Density Facilities

Liebert XDU is a critical component in the transition from traditional air cooling to high-performance liquid cooling. It provides secure and precise heat transfer of up to 1368 kW between the facility loop and the server cooling loop, supporting the direct-to-chip cooling requirements of AI and HPC servers.

Recommended Applications

  • AI and GPU-intensive data centers
  • High-Performance Computing facilities
  • Direct-to-chip cooling applications
  • Rear-door heat exchanger systems
  • Hybrid facilities transitioning to liquid cooling

Why Choose Liebert XDU?

Critical System Protection and Loop Integrity

Liebert XDU completely separates the data center facility loop from the sensitive secondary loop, eliminating leakage and contamination risks.

  • Stainless-Steel Design: All piping and components in the secondary loop are manufactured from high-quality stainless steel to preserve fluid quality and prevent corrosion.
  • Advanced Filtration: Integrated triple-redundant 50-micron filters can be cleaned while the system remains operational, supporting continuous fluid cleanliness.
  • Intelligent Leak Detection: The closed-loop piping design and integrated sensors immediately detect potential leaks and protect critical equipment.

High-Performance Thermal Management and Intelligent Control

Developed for demanding AI and HPC workloads, Liebert XDU responds immediately to dynamic heat loads and maintains server-level thermal stability.

  • 1368 kW Cooling Capacity Provides 1368 kW of heat transfer capacity at an approach temperature difference of only 4°C, supporting even the highest-density racks.
  • Triple-Pump System: The N+1 redundant pump architecture, managed by intelligent inverters, maintains continuous liquid flow and pressure.
  • 7-Inch Color Touchscreen: An ARM Cortex-M7-based controller provides flow monitoring, precise temperature control and detailed reporting.
Feature
Technical Detail / Value

Nominal Cooling Capacity

1368 kW at 7.2°F / 4°C ATD

Maximum Cooling Capacity

2912 kW at 14.4°F / 8°C ATD

Nominal Flow Rate – 2 Pumps

1,200 L/min (317 gpm)

Maximum Flow Rate – 3 Pumps

1,800 L/min (475.5 gpm)

Secondary-Loop Coolant

Water, water/glycol or compatible single-phase fluids

Pump Redundancy

N+1 dual-pump or N three-pump operating modes

Temperature Control Range

10°C to 52°C (50°F–126°F), with standard dew-point control

Dimensions – H × W × D

2069 × 900 × 1243 mm

Weight

Approximately 650 kg (1,433 lb)

Communications and Monitoring

RS-485 RTU Modbus, TCP/IP, SNMP, CLI and web interface

Technical Article: XDU070 Hybrid Liquid Cooling Solution

Critical Systems, Engineered for What’s Next


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